高密度実装応用を目的とした種々の基板材料への無電解Ni-Pめっきの前処理とその条件の最適化
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- Material Type
- 記事
- Author/Editor
- 中田 龍之介渡辺 宣朗押切 絢貴 他
- Alternative Title
- Optimization of Pretreatment Conditions for Electroless Ni-P Plating Simultaneously on Various Substrates for High Density Packaging
- Periodical title
- 表面技術 = Journal of the Surface Finishing Society of Japan
- No. or year of volume/issue
- 64(5):2013.5
- Volume
- 64
- Issue
- 5
- Pages
- 302-306