Low Temperature Deposition of Cu Thin Film on Polyimide Using RF-driven Atmospheric Pressure Plasma Jet in Nitrogen Atmosphere

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Low Temperature Deposition of Cu Thin Film on Polyimide Using RF-driven Atmospheric Pressure Plasma Jet in Nitrogen Atmosphere

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Material Type: 記事
Title: Low Temperature Deposition of Cu Thin Film on Polyimide Using RF-driven Atmospheric Pressure Plasma Jet in Nitrogen Atmosphere
Author/Editor: Peng Zhao
Wei Zheng
Yuedong Meng 他
Author Heading: Peng Zhao
Wei Zheng
Yuedong Meng
Periodical title: Journal of photopolymer science and technology
No. or year of volume/issue: 26(4):2013
Volume: 26
Issue: 4
Pages: 549-554
Publication date of volume/issue (W3CDTF): 2013
ISSN (Periodical Title): 0914-9244
ISSN-L (Periodical Title): 0914-9244
Publication (Periodical Title): Chiba : The Society of Photopolymer Science and Technology
Place of Publication (Country Code): JP
Text Language Code: eng
Subject Heading: atmospheric pressure plasma jet
polyimide
Cu film
Deposition
NDLC: ZP48
Target Audience: 一般
Holding library: 国立国会図書館
Call No.: Z53-W515
Data Provider (Database): 国立国会図書館 : 国立国会図書館雑誌記事索引
https://ndlsearch.ndl.go.jp
Bibliographic ID (NDL): 024660395
http://id.ndl.go.jp/bib/024660395
Bibliographic Record Category (NDL): 632