半導体機器用Cr-Cu材ヒートシンクの焼結条件と溶浸性の関係

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半導体機器用Cr-Cu材ヒートシンクの焼結条件と溶浸性の関係

Call No. (NDL)
Z17-274
Bibliographic ID of National Diet Library
024852705
Material type
記事
Author
寺尾 星明ほか
Publisher
京都 : 粉体粉末冶金協会
Publication date
2013-08
Material Format
Paper
Journal name
粉体および粉末冶金 = Journal of the Japan Society of Powder and Powder Metallurgy : 粉体粉末冶金協会誌 / 粉体粉末冶金協会 編 60(8):2013.8
Publication Page
p.367-372
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Material Type
記事
Author/Editor
寺尾 星明
小日置 英明
太田 裕樹 他
Alternative Title
study on Sintering Conditions Affecting Infiltrability of Cr-Cu Heat-sink for Semiconductor Devices
Periodical title
粉体および粉末冶金 = Journal of the Japan Society of Powder and Powder Metallurgy : 粉体粉末冶金協会誌 / 粉体粉末冶金協会 編
No. or year of volume/issue
60(8):2013.8
Volume
60
Issue
8
Pages
367-372