電着銅薄膜を利用した応力測定法 : 雰囲気温度が粒子成長へ及ぼす影響
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- Material Type
- 記事
- Author/Editor
- 小野 勇一八木 康行宮近 幸逸
- Alternative Title
- Stress Measurement Method Using Electrodeposited Copper Foil : Effect of Ambient Temperatures on Grain Growth
- Periodical title
- 実験力学 : Journal of JSEM : Journal of the Japan Society for Experimental Mechanics / 日本実験力学会編集委員会 編
- No. or year of volume/issue
- 13(3):2013.9
- Volume
- 13
- Issue
- 3
- Pages
- 300-305