半導体封止材料の最近の動向 (特集半導体用ポリマー)

半導体封止材料の最近の動向

(特集半導体用ポリマー)

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Material Type: 記事
Title: 半導体封止材料の最近の動向
Author/Editor: 成瀬滋
Series Title: 特集半導体用ポリマー
Author Heading: 成瀬滋
Periodical title: Polyfile = ポリファイル : 高分子関連技術情報誌
No. or year of volume/issue: 38(5)=447:2001.5
Volume: 38
Issue: 5
Sequential issue number: 447
Pages: 22-25
Publication date of volume/issue (W3CDTF): 2001-05
ISSN (Periodical Title): 0910-2175
ISSN-L (Periodical Title): 0910-2175
Publication (Periodical Title): 東京 : 大成社
Place of Publication (Country Code): JP
Text Language Code: jpn
NDLC: ZP16
Target Audience: 一般
Holding library: 国立国会図書館
Call No.: Z17-153
Data Provider (Database): 国立国会図書館 : 国立国会図書館雑誌記事索引
https://ndlsearch.ndl.go.jp
Bibliographic ID (NDL): 024955920
http://id.ndl.go.jp/bib/024955920
Bibliographic Record Category (NDL): 632