放熱用金属バルク材料と電子デバイス用ウエハの大気中低温接合技術の開発

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Material Type: 記事
Title: 放熱用金属バルク材料と電子デバイス用ウエハの大気中低温接合技術の開発
Author/Editor: 今一恵
魚本幸
島津武仁
Author Heading: 今一恵
魚本幸
島津武仁
Alternative Title: Room Temperature Bonding of Wafers and Metals using Au Films in Air
Periodical title: マイクロエレクトロニクスシンポジウム論文集
No. or year of volume/issue: 23:2013.9.12・13
Volume: 23
Pages: 143-146
Publication date of volume/issue (W3CDTF): 2013-09
Publication (Periodical Title): 東京 : エレクトロニクス実装学会
Place of Publication (Country Code): JP
Text Language Code: jpn
NDLC: ZN33
Target Audience: 一般
Holding library: 国立国会図書館
Call No.: Z16-1617
Data Provider (Database): 国立国会図書館 : 国立国会図書館雑誌記事索引
https://ndlsearch.ndl.go.jp
Bibliographic ID (NDL): 025551016
http://id.ndl.go.jp/bib/025551016
Bibliographic Record Category (NDL): 632