半導体へのめっき工程におけるトラブルとその対策 : 無電解UBM形成におけるトラブル事例とその対策 (小特集 めっき現場のトラブルとその対策)
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- Material Type
- 記事
- Author/Editor
- 小山 有一川島 敏
- Series Title
- Alternative Title
- The Difficulties in Plating Process for Semiconductor and their Counter-Measures
- Periodical title
- 表面技術 = Journal of the Surface Finishing Society of Japan
- No. or year of volume/issue
- 65(7):2014.7
- Volume
- 65
- Issue
- 7