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Bibliographic Record
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- Material Type
- 記事
- Author/Editor
- サーマルマネジメント研究会
- Series Title
- Author Heading
- Alternative Title
- Steady State Thermal Conductivity Measurement Method of Specimens in Thickness and In-Plane Direction : Thermal Conductivity Measurement of TIMs and Multi-Layer Printed Wiring Boards
- Periodical title
- エレクトロニクス実装学会誌 = Journal of the Japan Institute of Electronics Packaging
- No. or year of volume/issue
- 18(1)=119:2015.1
- Volume
- 18
- Issue
- 1