LDS工法におけるM...

LDS工法におけるMIDめっきプロセスのファインピッチテクノロジー : ウェアラブル端末や自動車部品への適応 (特集 最新二次加工技術 : めっき・接合・溶着技術を中心に)

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LDS工法におけるMIDめっきプロセスのファインピッチテクノロジー : ウェアラブル端末や自動車部品への適応

(特集 最新二次加工技術 : めっき・接合・溶着技術を中心に)

Call No. (NDL)
Z17-149
Bibliographic ID of National Diet Library
026190382
Material type
記事
Author
渡邉 歳哉
Publisher
東京 : プラスチックスエージ
Publication date
2015-03
Material Format
Paper
Journal name
プラスチックスエージ = Plastics age 61(3)=739:2015.3
Publication Page
p.64-67
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Paper

Material Type
記事
Author/Editor
渡邉 歳哉
Author Heading
Alternative Title
MID Plating Process Fine Pitch Technology Employing LDS Method : Application to Wearable Terminals and Automobile Parts
Periodical title
プラスチックスエージ = Plastics age
No. or year of volume/issue
61(3)=739:2015.3
Volume
61
Issue
3