All-SiCモジュールのパッケージ技術 (特集エネルギーマネジメントに貢献するパワー半導体)

All-SiCモジュールのパッケージ技術

(特集エネルギーマネジメントに貢献するパワー半導体)

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Material Type: 記事
Title: All-SiCモジュールのパッケージ技術
Author/Editor: 仲村秀世
西澤龍男
梨子田典弘
Series Title: 特集エネルギーマネジメントに貢献するパワー半導体
Author Heading: 仲村秀世
西澤龍男
梨子田典弘
Alternative Title: All―SiC Module Packaging Technology
Periodical title: 富士電機技報 = Fuji Electric journal
No. or year of volume/issue: 88(4)=888:2015.12
Volume: 88
Issue: 4
Sequential issue number: 888
Pages: 241-244
Publication date of volume/issue (W3CDTF): 2015-12
ISSN (Periodical Title): 2187-1817
ISSN-L (Periodical Title): 2187-1817
Publication (Periodical Title): 東京 : 富士電機技術開発本部 ; 2012-
Place of Publication (Country Code): JP
Text Language Code: jpn
NDLC: ZN31
Target Audience: 一般
Holding library: 国立国会図書館
Call No.: Z16-245
Data Provider (Database): 国立国会図書館 : 国立国会図書館雑誌記事索引
https://ndlsearch.ndl.go.jp
Bibliographic ID (NDL): 027077017
http://id.ndl.go.jp/bib/027077017
Bibliographic Record Category (NDL): 632