3次元IC積層実装技術の実用化への取り組み : 基盤技術から実用技術へどのようにしてステップアップするのか?

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Material Type: 記事
Title: 3次元IC積層実装技術の実用化への取り組み : 基盤技術から実用技術へどのようにしてステップアップするのか?
Author/Editor: 青柳昌宏
居村史人
加藤史樹他
Author Heading: 青柳昌宏
居村史人
加藤史樹
Alternative Title: Developing an application for 3D IC chip stacking technology : How to shift from fundamental to practical technology?
Periodical title: Synthesiology = 構成学 / シンセシオロジー編集委員会編
No. or year of volume/issue: 9(1):2016.2
Volume: 9
Issue: 1
Pages: 1-14
Publication date of volume/issue (W3CDTF): 2016-02
ISSN (Periodical Title): 1882-6229
ISSN-L (Periodical Title): 1882-6229
Publication (Periodical Title): [つくば] : 産業技術総合研究所
Place of Publication (Country Code): JP
Text Language Code: jpn
Subject Heading: 半導体デバイス
IC
3次元積層
実装
TSV
Semiconductor device
3D stacking
packaging
NDLC: ZM2
Target Audience: 一般
Holding library: 国立国会図書館
Call No.: Z74-F693
Data Provider (Database): 国立国会図書館 : 国立国会図書館雑誌記事索引
https://ndlsearch.ndl.go.jp
Bibliographic ID (NDL): 027191933
http://id.ndl.go.jp/bib/027191933
Bibliographic Record Category (NDL): 632