パワーモジュール向け高温Pbフリーはんだの開発と高信頼性化 (特集 SiCパワーデバイスの高耐熱接合技術と材料開発)

パワーモジュール向け高温Pbフリーはんだの開発と高信頼性化

(特集 SiCパワーデバイスの高耐熱接合技術と材料開発)

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Material Type: 記事
Title: パワーモジュール向け高温Pbフリーはんだの開発と高信頼性化
Author/Editor: 高森雅人
Series Title: 特集 SiCパワーデバイスの高耐熱接合技術と材料開発
Author Heading: 高森雅人
Alternative Title: Development and High-reliability of High-Temperature Pb-Free Solders for Power Module
Periodical title: エネルギーデバイス = Energy device / 技術情報協会編
No. or year of volume/issue: 3(5)=18:2016.6
Volume: 3
Issue: 5
Sequential issue number: 18
Pages: 1-8
Publication date of volume/issue (W3CDTF): 2016-06
ISSN (Periodical Title): 2188-1383
ISSN-L (Periodical Title): 2188-1383
Publication (Periodical Title): 東京 : 技術情報協会
Place of Publication (Country Code): JP
Text Language Code: jpn
NDLC: ZN32
Target Audience: 一般
Holding library: 国立国会図書館
Call No.: Z74-H900
Data Provider (Database): 国立国会図書館 : 国立国会図書館雑誌記事索引
https://ndlsearch.ndl.go.jp
Bibliographic ID (NDL): 027513253
http://id.ndl.go.jp/bib/027513253
Bibliographic Record Category (NDL): 632