生体親和性エレクトロニクス実装のための低温大気圧接合技術

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Material Type: 記事
Title: 生体親和性エレクトロニクス実装のための低温大気圧接合技術
Author/Editor: 重藤暁津
付偉欣
水野潤
庄子習一
Author Heading: 重藤暁津
付偉欣
水野潤
庄子習一
Alternative Title: Low Temperature Hybrid Bonding Without Vacuum Atmosphere for Future Bioelectronics Packaging
Periodical title: マイクロエレクトロニクスシンポジウム論文集
No. or year of volume/issue: 26:2016.9.8・9
Volume: 26
Pages: 251-254
Publication date of volume/issue (W3CDTF): 2016-09
Publication (Periodical Title): 東京 : エレクトロニクス実装学会
Place of Publication (Country Code): JP
Text Language Code: jpn
NDLC: ZN33
Target Audience: 一般
Holding library: 国立国会図書館
Call No.: Z16-1617
Data Provider (Database): 国立国会図書館 : 国立国会図書館雑誌記事索引
https://ndlsearch.ndl.go.jp
Bibliographic ID (NDL): 027776512
http://id.ndl.go.jp/bib/027776512
Bibliographic Record Category (NDL): 632