Niメッキによる高生産性パワーデバイス接合技術

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Material Type: 記事
Title: Niメッキによる高生産性パワーデバイス接合技術
Author/Editor: 巽宏平
飯塚智徳
Author Heading: 巽宏平
飯塚智徳
Alternative Title: Ni micro-plating bonding for power device interconnection
Periodical title: 応用物理
No. or year of volume/issue: 86(2)=972:2017.2
Volume: 86
Issue: 2
Sequential issue number: 972
Pages: 112-116
Publication date of volume/issue (W3CDTF): 2017-02
ISSN (Periodical Title): 0369-8009
ISSN-L (Periodical Title): 0369-8009
Publication (Periodical Title): 東京 : 応用物理学会
Place of Publication (Country Code): JP
Text Language Code: jpn
NDLC: ZM17
Target Audience: 一般
Holding library: 国立国会図書館
Call No.: Z15-243
Data Provider (Database): 国立国会図書館 : 国立国会図書館雑誌記事索引
https://ndlsearch.ndl.go.jp
Bibliographic ID (NDL): 027997890
http://id.ndl.go.jp/bib/027997890
Bibliographic Record Category (NDL): 632