Volume number407号 2017年5月
Niナノ粒子を用いた...

Niナノ粒子を用いた高温実装用素子接合技術の開発 (新素材特集)

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Niナノ粒子を用いた高温実装用素子接合技術の開発

(新素材特集)

Call No. (NDL)
Z17-328
Bibliographic ID of National Diet Library
028297563
Material type
記事
Author
松原 典恵ほか
Publisher
東京 : 新日鐡住金技術開発本部・技術開発企画部
Publication date
2017-05
Material Format
Paper
Journal name
新日鉄住金技報 / 新日鐡住金株式会社技術開発本部, 技術開発企画部 編 (407):2017.5
Publication Page
p.8-14
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Paper

Material Type
記事
Author/Editor
松原 典恵
宇野 智裕
千葉 将之
清水 隆之
Series Title
Alternative Title
Jointing Technique for Power Semiconductors Using Ni-nanoparticles
Periodical title
新日鉄住金技報 / 新日鐡住金株式会社技術開発本部, 技術開発企画部 編
No. or year of volume/issue
(407):2017.5
Issue
407
Pages
8-14