宇宙機に求められるMCM実装技術(特集 IoT時代のシステムインテグレーション技術)

Journal name: エレクトロニクス実装学会誌 = Journal of the Japan Institute of Electronics Packaging 20(4)=136:2017.7

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Material Type: 記事
Title: 宇宙機に求められるMCM実装技術
Author/Editor: 小川文輔
檜原弘樹
河上聡子
Series Title: 特集 IoT時代のシステムインテグレーション技術
Author Heading: 小川文輔
檜原弘樹
河上聡子
Alternative Title: MCM Assembly Technology for Space Applications
Periodical title: エレクトロニクス実装学会誌 = Journal of the Japan Institute of Electronics Packaging
No. or year of volume/issue: 20(4)=136:2017.7
Volume: 20
Issue: 4
Sequential issue number: 136
Pages: 192-195
Publication date of volume/issue (W3CDTF): 2017-07
ISSN (Periodical Title): 1343-9677
ISSN-L (Periodical Title): 1343-9677
Publication (Periodical Title): 東京 : エレクトロニクス実装学会
Place of Publication (Country Code): JP
Text Language Code: jpn
NDLC: ZN33
Target Audience: 一般
Holding library: 国立国会図書館
Call No.: Z74-B258
Data Provider (Database): 国立国会図書館 : 国立国会図書館雑誌記事索引
https://ndlsearch.ndl.go.jp
Bibliographic ID (NDL): 028380478
http://id.ndl.go.jp/bib/028380478
Bibliographic Record Category (NDL): 632