積層セラミックチップ...

積層セラミックチップコンデンサの結合容量としての広帯域特性 (電子回路研究会・高周波集積回路の新分野展開と対応技術)

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積層セラミックチップコンデンサの結合容量としての広帯域特性

(電子回路研究会・高周波集積回路の新分野展開と対応技術)

Call No. (NDL)
Z43-2257
Bibliographic ID of National Diet Library
028451031
Material type
記事
Author
加藤 善斗ほか
Publisher
東京 : 電気学会
Publication date
2017-07-20
Material Format
Paper
Journal name
電気学会研究会資料. ECT = The papers of technical meeting on electronic circuits, IEE Japan / 電子回路研究会 [編] 2017(70-75):2017.7.20
Publication Page
p.11-16
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Paper

Material Type
記事
Author/Editor
加藤 善斗
大島 拓実
柴田 随道
綱島 聡
荒武 淳
Alternative Title
Characteristics of Multi-Layer Ceramic Chip Capacitor for the Broadband Signal Coupling
Periodical title
電気学会研究会資料. ECT = The papers of technical meeting on electronic circuits, IEE Japan / 電子回路研究会 [編]
No. or year of volume/issue
2017(70-75):2017.7.20
Volume
2017
Issue
70-75