銅配線上への無電解パ...

銅配線上への無電解パラジウム/金めっきに及ぼす脱脂処理およびソフトエッチング処理の影響

Icons representing 記事

銅配線上への無電解パラジウム/金めっきに及ぼす脱脂処理およびソフトエッチング処理の影響

Call No. (NDL)
Z17-291
Bibliographic ID of National Diet Library
028454818
Material type
記事
Author
加藤 友人ほか
Publisher
東京 : 表面技術協会
Publication date
2017-08
Material Format
Paper
Journal name
表面技術 = Journal of the Surface Finishing Society of Japan 68(8):2017.8
Publication Page
p.455-461
View All

Holdings of Libraries in Japan

This page shows libraries in Japan other than the National Diet Library that hold the material.

Please contact your local library for information on how to use materials or whether it is possible to request materials from the holding libraries.

other

  • CiNii Research

    Search Service
    Digital
    You can check the holdings of institutions and databases with which CiNii Research is linked at the site of CiNii Research.

Bibliographic Record

You can check the details of this material, its authority (keywords that refer to materials on the same subject, author's name, etc.), etc.

Paper Digital

Material Type
記事
Author/Editor
加藤 友人
寺島 肇
渡邊 秀人
渡邊 充広
本間 英夫
高井 治
Alternative Title
Influence of Cleaning and Soft Etching for Electroless Palladium/Gold Plating on Copper Fine Pattern
Periodical title
表面技術 = Journal of the Surface Finishing Society of Japan
No. or year of volume/issue
68(8):2017.8
Volume
68
Issue
8
Pages
455-461