電子材料向け熱硬化性樹脂の開発動向
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- Material Type
- 記事
- Title
- Author/Editor
- 大野 大典
- Author Heading
- Alternative Title
- Development of Thermosetting Resins for Electronic Materials
- Periodical title
- ネットワークポリマー = Journal of network polymer, Japan
- No. or year of volume/issue
- 38(6):2017
- Volume
- 38
- Issue
- 6
- Pages
- 277-284