次世代パワーデバイス用SiC基板の研磨技術 (特集 半導体プラナリゼーションCMP技術)
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- Material Type
- 記事
- Author/Editor
- 佐野 泰久
- Series Title
- Author Heading
- Alternative Title
- Polishing Technique of Next-Generation Power Semiconductor SiC Substrate
- Periodical title
- 精密工学会誌 = Journal of the Japan Society for Precision Engineering / 会誌編集委員会 編
- No. or year of volume/issue
- 84(3)=999:2018.3
- Volume
- 84
- Issue
- 3