Volume number2017年度
電界砥粒制御技術を用...

電界砥粒制御技術を用いた次世代半導体基板研磨システムの開発(第5報)

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電界砥粒制御技術を用いた次世代半導体基板研磨システムの開発(第5報)

Call No. (NDL)
Z43-1295
Bibliographic ID of National Diet Library
029145083
Material type
記事
Author
久住 孝幸ほか
Publisher
秋田 : 秋田県産業技術センター
Publication date
2017
Material Format
Paper
Journal name
業務年報 = Annual report of Akita Industrial Technology Center / 秋田県産業技術センター 編 2017年度
Publication Page
p.98-101
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Paper

Material Type
記事
Author/Editor
久住 孝幸
中村 竜太
越後谷 正見
Alternative Title
Development of the advanced polishing technology for next-generation semiconductor substrates using controlled slurry under AC electric field(5)
Periodical title
業務年報 = Annual report of Akita Industrial Technology Center / 秋田県産業技術センター 編
No. or year of volume/issue
2017年度
Pages
98-101
Publication date of volume/issue (W3CDTF)
2017
ISSN (Periodical Title)
2187-3380