セラミックチップ部品のクラック解析技術 : 電位コントラスト法による微小クラックの検出

Journal name: 日本信頼性学会春季信頼性シンポジウム発表報文集 = Proceedings of Spring Symposium on Reliability 26:2018.6.4

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Material Type: 記事
Title: セラミックチップ部品のクラック解析技術 : 電位コントラスト法による微小クラックの検出
Author/Editor: 斎藤彰
Author Heading: 斎藤彰
Alternative Title: Failure Analysis Technique for Crack of Ceramic Chip Components : Detective Technique for Crack using Voltage Contrast SEM Image
Periodical title: 日本信頼性学会春季信頼性シンポジウム発表報文集 = Proceedings of Spring Symposium on Reliability
No. or year of volume/issue: 26:2018.6.4
Volume: 26
Pages: 39-42
Publication date of volume/issue (W3CDTF): 2018-06-04
Publication (Periodical Title): 東京 : 日本信頼性学会
Place of Publication (Country Code): JP
Text Language Code: jpn
NDLC: ZM1
Target Audience: 一般
Holding library: 国立国会図書館
Call No.: Z74-J487
Data Provider (Database): 国立国会図書館 : 国立国会図書館雑誌記事索引
https://ndlsearch.ndl.go.jp
Bibliographic ID (NDL): 029506355
http://id.ndl.go.jp/bib/029506355
Bibliographic Record Category (NDL): 632