Niメッキ接合を用いたSiCパワーモジュールの熱抵抗と過渡熱解析
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- Material Type
- 記事
- Author/Editor
- 今給黎 明大小迫 雅裕匹田 政幸巽 宏平稲垣 雅一飯塚 智徳佐藤 信明清水 孝司上田 和敏杉浦 和彦鶴田 和弘戸田 敬二
- Alternative Title
- Thermal Resistance and Transient Thermal Analysis of SiC Power Module Using Ni Micro Plating Bonding
- Periodical title
- 電気学会論文誌. D, 産業応用部門誌 = IEEJ transactions on industry applications
- No. or year of volume/issue
- 139(10):2019.10
- Volume
- 139
- Issue
- 10
- Pages
- 838-846