有限要素法を用いた熱疲労特性に与えるSn-Ag-Cuはんだ接合部形状の影響評価

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Material Type: 記事
Title: 有限要素法を用いた熱疲労特性に与えるSn-Ag-Cuはんだ接合部形状の影響評価
Author/Editor: 森下真衣
麻寧緒
楢崎邦男
西川宏
Author Heading: 森下真衣
麻寧緒
楢崎邦男
西川宏
Alternative Title: Effect of Sn-Ag-Cu Solder Joint Shape on Thermal Fatigue Properties by Finite Element Method
Periodical title: マイクロエレクトロニクスシンポジウム論文集
No. or year of volume/issue: 29:2019.9.12・13
Volume: 29
Pages: 135-138
Publication date of volume/issue (W3CDTF): 2019-09
Publication (Periodical Title): 東京 : エレクトロニクス実装学会
Place of Publication (Country Code): JP
Text Language Code: jpn
NDLC: ZN33
Target Audience: 一般
Holding library: 国立国会図書館
Call No.: Z16-1617
Data Provider (Database): 国立国会図書館 : 国立国会図書館雑誌記事索引
https://ndlsearch.ndl.go.jp
Bibliographic ID (NDL): 030550825
http://id.ndl.go.jp/bib/030550825
Bibliographic Record Category (NDL): 632