パワーモジュール・ワイヤ接合部熱疲労強度評価に修正ひずみ硬化則の適用 (Mate2020特集号 : 第26回「エレクトロニクスにおけるマイクロ接合・実装技術」シンポジウム)
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- Material Type
- 記事
- Author/Editor
- 葉山 裕宍戸 信之牛尾 和也萩原 世也宮崎 則幸
- Alternative Title
- Application of Modified Strain Hardening Rule to Thermal Fatigue Strength Evaluation of Wire Bonding in Power Module
- Periodical title
- スマートプロセス学会誌 = Journal of smart processing
- No. or year of volume/issue
- 9(5):2020.9
- Volume
- 9
- Issue
- 5