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SiCパワーデバイス向け高耐熱ダイボンド材料とその接合技術 (特集 パワーデバイスに向けた接合材料の高耐熱化と低温焼結)

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SiCパワーデバイス向け高耐熱ダイボンド材料とその接合技術

(特集 パワーデバイスに向けた接合材料の高耐熱化と低温焼結)

Call No. (NDL)
Z74-C308
Bibliographic ID of National Diet Library
030682835
Material type
記事
Author
山口 朋彦ほか
Publisher
東京 : 技術情報協会
Publication date
2020-08
Material Format
Paper
Journal name
Material stage / 技術情報協会 編 20(5)=233:2020.8
Publication Page
p.24-30
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Paper

Material Type
記事
Author/Editor
山口 朋彦
岩田 広太郎
増山 弘太郎
乙川 光平
中矢 清隆
Periodical title
Material stage / 技術情報協会 編
No. or year of volume/issue
20(5)=233:2020.8
Volume
20
Issue
5
Sequential issue number
233