次世代パワーデバイス実装技術講座(第4回)パワーデバイス実装用セラミックス基板

Journal name: エレクトロニクス実装学会誌 = Journal of the Japan Institute of Electronics Packaging 24(7)=167:2021.11

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Material Type: 記事
Title: 次世代パワーデバイス実装技術講座(第4回)パワーデバイス実装用セラミックス基板
Author/Editor: 多々見純一
Author Heading: 多々見純一
Alternative Title: Ceramic Substrate for Power Devices
Periodical title: エレクトロニクス実装学会誌 = Journal of the Japan Institute of Electronics Packaging
No. or year of volume/issue: 24(7)=167:2021.11
Volume: 24
Issue: 7
Sequential issue number: 167
Pages: 680-683
Publication date of volume/issue (W3CDTF): 2021-11
Publication (Periodical Title): [東京] : エレクトロニクス実装学会
Place of Publication (Country Code): JP
Text Language Code: jpn
NDLC: ZN33
Target Audience: 一般
Holding library: 国立国会図書館
Call No.: YH247-1720
Data Provider (Database): 国立国会図書館 : 国立国会図書館雑誌記事索引
https://ndlsearch.ndl.go.jp
Bibliographic ID (NDL): 031774318
http://id.ndl.go.jp/bib/031774318
Bibliographic Record Category (NDL): 632