パワーデバイス内部の銅基板-封止樹脂界面における疲労き裂進展則の検討

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Material Type: 記事
Title: パワーデバイス内部の銅基板-封止樹脂界面における疲労き裂進展則の検討
Author/Editor: 高橋雄太
池田徹
小金丸正明
加々良剛志
畑尾卓也
Author Heading: 高橋雄太
池田徹
小金丸正明
加々良剛志
畑尾卓也
Alternative Title: Investigation of the Fatigue Crack Extension Law along an Interface between Cu Substrate and Molding Resin in a Power Device
Periodical title: マイクロエレクトロニクスシンポジウム論文集
No. or year of volume/issue: 31:2021.9.20-22
Volume: 31
Pages: 83-86
Publication date of volume/issue (W3CDTF): 2021-09
Publication (Periodical Title): 東京 : エレクトロニクス実装学会
Place of Publication (Country Code): JP
Text Language Code: jpn
NDLC: ZN33
Target Audience: 一般
Holding library: 国立国会図書館
Call No.: Z16-1617
Data Provider (Database): 国立国会図書館 : 国立国会図書館雑誌記事索引
https://ndlsearch.ndl.go.jp
Bibliographic ID (NDL): 031962976
http://id.ndl.go.jp/bib/031962976
Bibliographic Record Category (NDL): 632