Siphチップとファイバとの高効率接続を目指した光硬化樹脂デバイス(特集 Co-packaged opticsへ向けたポリマー光導波路技術の新展開)

Journal name: エレクトロニクス実装学会誌 = Journal of the Japan Institute of Electronics Packaging 25(2)=169:2022.3

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Material Type: 記事
Title: Siphチップとファイバとの高効率接続を目指した光硬化樹脂デバイス
Author/Editor: 藤川知栄美
三上修
Series Title: 特集 Co-packaged opticsへ向けたポリマー光導波路技術の新展開
Author Heading: 藤川知栄美
三上修
Alternative Title: Coupling Device by Self-Written Waveguide Technology for Optical Interconnection between Silicon Photonics Chip and Fiber
Periodical title: エレクトロニクス実装学会誌 = Journal of the Japan Institute of Electronics Packaging
No. or year of volume/issue: 25(2)=169:2022.3
Volume: 25
Issue: 2
Sequential issue number: 169
Pages: 166-171
Publication date of volume/issue (W3CDTF): 2022-03
Publication (Periodical Title): [東京] : エレクトロニクス実装学会
Place of Publication (Country Code): JP
Text Language Code: jpn
NDLC: ZN33
Target Audience: 一般
Holding library: 国立国会図書館
Call No.: YH247-1720
Data Provider (Database): 国立国会図書館 : 国立国会図書館雑誌記事索引
https://ndlsearch.ndl.go.jp
Bibliographic ID (NDL): 032002637
http://id.ndl.go.jp/bib/032002637
Bibliographic Record Category (NDL): 632