Fatigue Life Prediction of Die-Attach Joint in Power Semiconductors Subjected to Biaxial Stress by High-Speed Thermal Cycling (Special Issue on Frontier Research on Bonding and Interconnect Materials for Electric Components and Related Microprocessing(Part 3))
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- Material Type
- 記事
- Author/Editor
- Hiroki KanaiYoshiharu KariyaHiroshige SugimotoYoshiki AbeYoshinori YokoyamaKoki OchiRyuichiro HanadaShinnosuke Soda
- Author Heading
- Periodical title
- Materials transactions
- No. or year of volume/issue
- 63(6):2022.6
- Volume
- 63
- Issue
- 6
- Pages
- 759-765