Adhesion Mechanism between Mold Resin and Sputtered Stainless Steel Ground Films for Electromagnetic Wave Shield Packages (Special Issue on Frontier Research on Bonding and Interconnect Materials for Electric Components and Related Microprocessing(Part 3))
Digital data available（Japan Link Center）
Begin reading now
CiNii Research
Holdings of Libraries in Japan
This page shows libraries in Japan other than the National Diet Library that hold the material.
Please contact your local library for information on how to use materials or whether it is possible to request materials from the holding libraries.
other
CiNii Research
Search ServiceDigitalYou can check the holdings of institutions and databases with which CiNii Research is linked at the site of CiNii Research.
Bibliographic Record
You can check the details of this material, its authority (keywords that refer to materials on the same subject, author's name, etc.), etc.
- Material Type
- 記事
- Author/Editor
- Soichi HommaYuusuke TakanoTakeshi WatanabeKazuhiro MurakamiMasatoshi FukudaTakashi ImotoHiroshi Nishikawa
- Author Heading
- Periodical title
- Materials transactions
- No. or year of volume/issue
- 63(6):2022.6
- Volume
- 63
- Issue
- 6
- Pages
- 766-775