パワーデバイス用SiCウエハ加工の現状と展望 (特集次世代デバイスを支える精密仕上げ技術)

パワーデバイス用SiCウエハ加工の現状と展望

(特集次世代デバイスを支える精密仕上げ技術)

Journal name: 精密工学会誌 = Journal of the Japan Society for Precision Engineering / 会誌編集委員会編 89(5)=1061:2023.5

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Material Type: 記事
Title: パワーデバイス用SiCウエハ加工の現状と展望
Author/Editor: 河田研治
Series Title: 特集次世代デバイスを支える精密仕上げ技術
Author Heading: 河田研治
Alternative Title: Current Status and Vision in Machining Technology of SiC Wafers for Power Devices
Periodical title: 精密工学会誌 = Journal of the Japan Society for Precision Engineering / 会誌編集委員会編
No. or year of volume/issue: 89(5)=1061:2023.5
Volume: 89
Issue: 5
Sequential issue number: 1061
Pages: 359-362
Publication date of volume/issue (W3CDTF): 2023-05
ISSN (Periodical Title): 0912-0289
ISSN-L (Periodical Title): 0912-0289
Publication (Periodical Title): 東京 : 精密工学会
Place of Publication (Country Code): JP
Text Language Code: jpn
NDLC: ZN12
Target Audience: 一般
Holding library: 国立国会図書館
Call No.: Z16-466
Data Provider (Database): 国立国会図書館 : 国立国会図書館雑誌記事索引
https://ndlsearch.ndl.go.jp
Bibliographic ID (NDL): 032877710
http://id.ndl.go.jp/bib/032877710
Bibliographic Record Category (NDL): 632