ウェハボンディングの低温化とデバイス応用 (磁気応用のための新奇な微細加工技術)

ウェハボンディングの低温化とデバイス応用

(磁気応用のための新奇な微細加工技術)

Journal name: 社団法人日本磁気学会研究会資料 = Bulletin of Topical Symposium of the Magnetics Society of Japan 245:2023.11.10

This page shows libraries in Japan other than the National Diet Library that hold the material.

Please contact your local library for information on how to use materials or whether it is possible to request materials from the holding libraries.

other

CiNii Research
Search Service
You can check the holdings of institutions and databases with which CiNii Research is linked at the site of CiNii Research.
Check the holdings of this book

You can check the details of this material, its authority (keywords that refer to materials on the same subject, author's name, etc.), etc.

Material Type: 記事
Title: ウェハボンディングの低温化とデバイス応用
Author/Editor: 高木秀樹
Series Title: 磁気応用のための新奇な微細加工技術
Author Heading: 高木秀樹
Alternative Title: Low-temperature wafer bonding and its application for micro devices
Periodical title: 社団法人日本磁気学会研究会資料 = Bulletin of Topical Symposium of the Magnetics Society of Japan
No. or year of volume/issue: 245:2023.11.10
Volume: 245
Pages: 9-13
Publication date of volume/issue (W3CDTF): 2023-11-10
ISSN (Periodical Title): 1882-2940
ISSN-L (Periodical Title): 1882-2940
Publication (Periodical Title): 東京 : 日本磁気学会
Place of Publication (Country Code): JP
Text Language Code: jpn
NDLC: ZN31
Target Audience: 一般
Holding library: 国立国会図書館
Call No.: Z43-594
Data Provider (Database): 国立国会図書館 : 国立国会図書館雑誌記事索引
https://ndlsearch.ndl.go.jp
Bibliographic ID (NDL): 033351665
http://id.ndl.go.jp/bib/033351665
Bibliographic Record Category (NDL): 632