雑誌電気化学および工業物理化学
Volume number77(8) 2009.8
ArticleCu-Sn allo...

Cu-Sn alloy metallization of polymer substrate through reduction-diffusion method using ionic liquid bath at medium-low temperatures (Molten salts and ionic liquids: in novel view of liquid electrolyte)

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Cu-Sn alloy metallization of polymer substrate through reduction-diffusion method using ionic liquid bath at medium-low temperatures

(Molten salts and ionic liquids: in novel view of liquid electrolyte)

Call No. (NDL)
Z17-14
Bibliographic ID of National Diet Library
10341128
Material type
記事
Author
伊藤 輝ほか
Publisher
東京 : 電気化学協会
Publication date
2009-08
Material Format
Paper
Journal name
電気化学および工業物理化学 = Denki kagaku 77(8) 2009.8
Publication Page
p.677～679
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Paper

Material Type
記事
Title
Cu-Sn alloy metallization of polymer substrate through reduction-diffusion method using ionic liquid bath at medium-low temperatures
Author/Editor
伊藤 輝
邑瀬 邦明
一井 崇 他
Series Title
Molten salts and ionic liquids: in novel view of liquid electrolyte
Author Heading
伊藤 輝
邑瀬 邦明
一井 崇
Alternative Title
中低温イオン液体浴を用いた還元拡散法による樹脂基板のCu-Snメタライジング
Periodical title
電気化学および工業物理化学 = Denki kagaku
No. or year of volume/issue
77(8) 2009.8
Volume
77
Issue
8