チップ薄型化技術の現状と展望(特集システムインテグレーション実装技術の現状と展望)

Journal name: エレクトロニクス実装学会誌 = Journal of the Japan Institute of Electronics Packaging 12(4) (通号 80) 2009.7

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Material Type: 記事
Title: チップ薄型化技術の現状と展望
Author/Editor: 田久真也
黒澤哲也
清水紀子他
Series Title: 特集システムインテグレーション実装技術の現状と展望
Author Heading: 田久真也
黒澤哲也
清水紀子
Alternative Title: Recent progress and prospect of semiconductor device thinning technologies
Periodical title: エレクトロニクス実装学会誌 = Journal of the Japan Institute of Electronics Packaging
No. or year of volume/issue: 12(4) (通号 80) 2009.7
Volume: 12
Issue: 4
Sequential issue number: 80
Pages: 279～283
Publication date of volume/issue (W3CDTF): 2009-07
ISSN (Periodical Title): 1343-9677
ISSN-L (Periodical Title): 1343-9677
Publication (Periodical Title): 東京 : エレクトロニクス実装学会
Place of Publication (Country Code): JP
Text Language Code: jpn
NDLC: ZN33
Target Audience: 一般
Holding library: 国立国会図書館
Call No.: Z74-B258
Data Provider (Database): 国立国会図書館 : 国立国会図書館雑誌記事索引
https://ndlsearch.ndl.go.jp
Bibliographic ID (NDL): 10370296
http://id.ndl.go.jp/bib/10370296
Bibliographic Record Category (NDL): 632