高精細配線対応無電解Ni-P/Pd/Auめっき技術

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Material Type: 記事
Title: 高精細配線対応無電解Ni-P/Pd/Auめっき技術
Author/Editor: 江尻芳則
櫻井健久
川上裕他
Author Heading: 江尻芳則
櫻井健久
川上裕
Alternative Title: Electroless Ni-P/Pd/Au plating for high density semiconductor package substrates
Periodical title: マイクロエレクトロニクスシンポジウム論文集
No. or year of volume/issue: 18 2008.9.18・19
Volume: 18
Pages: 111～114
Publication date of volume/issue (W3CDTF): 2008-09
Publication (Periodical Title): 東京 : エレクトロニクス実装学会
Place of Publication (Country Code): JP
Text Language Code: jpn
NDLC: ZN33
Target Audience: 一般
Holding library: 国立国会図書館
Call No.: Z16-1617
Data Provider (Database): 国立国会図書館 : 国立国会図書館雑誌記事索引
https://ndlsearch.ndl.go.jp
Bibliographic ID (NDL): 10401435
http://id.ndl.go.jp/bib/10401435
Bibliographic Record Category (NDL): 632