Agナノ粒子によるフリップチップ接合技術の開発

Holdings of Libraries in Japan

This page shows libraries in Japan other than the National Diet Library that hold the material.

Please contact your local library for information on how to use materials or whether it is possible to request materials from the holding libraries.

other

CiNii Research
Search Service
Digital
You can check the holdings of institutions and databases with which CiNii Research is linked at the site of CiNii Research.
Check the holdings of this book

You can check the details of this material, its authority (keywords that refer to materials on the same subject, author's name, etc.), etc.

Material Type: 記事
Title: Agナノ粒子によるフリップチップ接合技術の開発
Author/Editor: 舟木達弥
前田剛伸
清野紳弥他
Author Heading: 舟木達弥
前田剛伸
清野紳弥
Alternative Title: Development of flip chip bonding technology using Ag nanoparticles
Periodical title: マイクロエレクトロニクスシンポジウム論文集
No. or year of volume/issue: 18 2008.9.18・19
Volume: 18
Pages: 151～154
Publication date of volume/issue (W3CDTF): 2008-09
Publication (Periodical Title): 東京 : エレクトロニクス実装学会
Place of Publication (Country Code): JP
Text Language Code: jpn
NDLC: ZN33
Target Audience: 一般
Holding library: 国立国会図書館
Call No.: Z16-1617
Data Provider (Database): 国立国会図書館 : 国立国会図書館雑誌記事索引
https://ndlsearch.ndl.go.jp
Bibliographic ID (NDL): 10401631
http://id.ndl.go.jp/bib/10401631
Bibliographic Record Category (NDL): 632