ガスデポジション法による円錐バンプの作製--MEMSデバイスの低温・低荷重ストレスフリー実装を目指して

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ガスデポジション法による円錐バンプの作製--MEMSデバイスの低温・低荷重ストレスフリー実装を目指して

Call No. (NDL)
Z16-1617
Bibliographic ID of National Diet Library
10401946
Material type
記事
Author
居村 史人ほか
Publisher
東京 : エレクトロニクス実装学会
Publication date
2008-09
Material Format
Paper
Journal name
マイクロエレクトロニクスシンポジウム論文集 18 2008.9.18・19
Publication Page
p.191~194
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Paper

Material Type
記事
Author/Editor
居村 史人
仲川 博
菊地 克弥 他
Alternative Title
Fabrication of cone-shaped micro-bump by gas deposition method: for stress-free packaging with low-temperature and low-load for MEMS-devices
Periodical title
マイクロエレクトロニクスシンポジウム論文集
No. or year of volume/issue
18 2008.9.18・19
Volume
18
Pages
191~194
Publication date of volume/issue (W3CDTF)
2008-09