要素技術 (特集 光回路実装の現状と将来展望)

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要素技術

(特集 光回路実装の現状と将来展望)

Call No. (NDL)
Z74-B258
Bibliographic ID of National Diet Library
10405707
Material type
記事
Author
-
Publisher
東京 : エレクトロニクス実装学会
Publication date
2009-08
Material Format
Paper
Journal name
エレクトロニクス実装学会誌 = Journal of the Japan Institute of Electronics Packaging 12(5) (通号 81) 2009.8
Publication Page
p.375~394
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Paper

Material Type
記事
Alternative Title
Components and packaging
Periodical title
エレクトロニクス実装学会誌 = Journal of the Japan Institute of Electronics Packaging
No. or year of volume/issue
12(5) (通号 81) 2009.8
Volume
12
Issue
5
Sequential issue number
81
Pages
375~394