UV硬化性樹脂とマスク転写法を用いたボードレベル光インターコネクション技術(特集光回路実装の現状と将来展望 ; 要素技術)

Journal name: エレクトロニクス実装学会誌 = Journal of the Japan Institute of Electronics Packaging 12(5) (通号 81) 2009.8

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Material Type: 記事
Title: UV硬化性樹脂とマスク転写法を用いたボードレベル光インターコネクション技術
Author/Editor: 神田昌宏
三上修
Series Title: 特集光回路実装の現状と将来展望 ; 要素技術
Author Heading: 神田昌宏
三上修
Alternative Title: Board level optical interconnection technologies applying UV curable resin and mask transfer method
Periodical title: エレクトロニクス実装学会誌 = Journal of the Japan Institute of Electronics Packaging
No. or year of volume/issue: 12(5) (通号 81) 2009.8
Volume: 12
Issue: 5
Sequential issue number: 81
Pages: 381～385
Publication date of volume/issue (W3CDTF): 2009-08
ISSN (Periodical Title): 1343-9677
ISSN-L (Periodical Title): 1343-9677
Publication (Periodical Title): 東京 : エレクトロニクス実装学会
Place of Publication (Country Code): JP
Text Language Code: jpn
NDLC: ZN33
Target Audience: 一般
Holding library: 国立国会図書館
Call No.: Z74-B258
Data Provider (Database): 国立国会図書館 : 国立国会図書館雑誌記事索引
https://ndlsearch.ndl.go.jp
Bibliographic ID (NDL): 10405720
http://id.ndl.go.jp/bib/10405720
Bibliographic Record Category (NDL): 632