波長多重光接続パッケージ内システム集積(WDM-OI-SiP)への期待(特集光回路実装の現状と将来展望 ; 次世代光インタコネクション技術)

Journal name: エレクトロニクス実装学会誌 = Journal of the Japan Institute of Electronics Packaging 12(5) (通号 81) 2009.8

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Material Type: 記事
Title: 波長多重光接続パッケージ内システム集積(WDM-OI-SiP)への期待
Author/Editor: 裏升吾
金高健二
Series Title: 特集光回路実装の現状と将来展望 ; 次世代光インタコネクション技術
Author Heading: 裏升吾
金高健二
Alternative Title: Potential of wavelength-division-multiplexing optical-interconnect system in package for future ultrahigh performance signal processing
Periodical title: エレクトロニクス実装学会誌 = Journal of the Japan Institute of Electronics Packaging
No. or year of volume/issue: 12(5) (通号 81) 2009.8
Volume: 12
Issue: 5
Sequential issue number: 81
Pages: 446～451
Publication date of volume/issue (W3CDTF): 2009-08
ISSN (Periodical Title): 1343-9677
ISSN-L (Periodical Title): 1343-9677
Publication (Periodical Title): 東京 : エレクトロニクス実装学会
Place of Publication (Country Code): JP
Text Language Code: jpn
NDLC: ZN33
Target Audience: 一般
Holding library: 国立国会図書館
Call No.: Z74-B258
Data Provider (Database): 国立国会図書館 : 国立国会図書館雑誌記事索引
https://ndlsearch.ndl.go.jp
Bibliographic ID (NDL): 10405829
http://id.ndl.go.jp/bib/10405829
Bibliographic Record Category (NDL): 632