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雑誌電子情報通信学会技術研究報告 : 信学技報
Volume number109(259)-109(266):2009.10.29-2009.11.6
Articleリレーの耐熱封止性に...

リレーの耐熱封止性に及ぼす接着剤の影響--接着剤組成による表面実装リレー耐熱封止性への影響 (機構デバイス)

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リレーの耐熱封止性に及ぼす接着剤の影響--接着剤組成による表面実装リレー耐熱封止性への影響

(機構デバイス)

Call No. (NDL)
Z16-940
Bibliographic ID of National Diet Library
10434624
Material type
記事
Author
福原 智博
Publisher
東京 : 電子情報通信学会
Publication date
2009-10-30
Material Format
Paper
Journal name
電子情報通信学会技術研究報告 = IEICE technical report : 信学技報 109(263) 2009.10.30
Publication Page
p.51～56
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Paper

Material Type
記事
Title
リレーの耐熱封止性に及ぼす接着剤の影響--接着剤組成による表面実装リレー耐熱封止性への影響
Author/Editor
福原 智博
Series Title
機構デバイス
Author Heading
福原 智博
Alternative Title
The influence of adhesives for heat resistant sealing characteristic for relay: the influence of constituent materials of adhesives for heat resistant sealing characteristic for surface mount relays
Periodical title
電子情報通信学会技術研究報告 = IEICE technical report : 信学技報
No. or year of volume/issue
109(263) 2009.10.30
Volume
109
Issue
263