Copper multilayer interconnection using ultraviolet nanoimprint lithography with a double-deck mold and electroplating
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- Material Type
- 記事
- Author/Editor
- Noriyasu NagaiHiroshi OnoKatsuyuki Sakuma 他
- Author Heading
- Periodical title
- Japanese journal of applied physics : JJAP
- No. or year of volume/issue
- 48(11) 2009.11
- Volume
- 48
- Issue
- 11
- Pages
- 115001-1～5
- Publication date of volume/issue (W3CDTF)
- 2009-11