Study of thermal stability of ultrafine-grained copper by means of electron back scattering diffraction (Special issue on development and fabrication of advanced materials assisted by nanotechnology and microanalysis)

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Study of thermal stability of ultrafine-grained copper by means of electron back scattering diffraction(Special issue on development and fabrication of advanced materials assisted by nanotechnology and microanalysis)

Call No. (NDL): Z53-J286
Bibliographic ID of National Diet Library: 10532943

Material type: 記事

Author: Ondrej Manほか

Publisher: Sendai : The Japan Institute of Metals and Materials ; 2001-

Publication date: 2010-02

Material Format: Paper

Journal name: Materials transactions 51(2) 2010.2

Publication Page: p.209～213

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Material Type: 記事
Title: Study of thermal stability of ultrafine-grained copper by means of electron back scattering diffraction
Author/Editor: Ondrej Man
Libor Pantelejev
Ludvik Kunz
Series Title: Special issue on development and fabrication of advanced materials assisted by nanotechnology and microanalysis
Author Heading: Ondrej Man
Libor Pantelejev
Ludvik Kunz
Periodical title: Materials transactions
No. or year of volume/issue: 51(2) 2010.2
Volume: 51
Issue: 2
Pages: 209～213
Publication date of volume/issue (W3CDTF): 2010-02
ISSN (Periodical Title): 1345-9678
ISSN-L (Periodical Title): 1345-9678
Publication (Periodical Title): Sendai : The Japan Institute of Metals and Materials ; 2001-
Place of Publication (Country Code): JP
Text Language Code: eng
Subject Heading: ultra-fine grained copper
thermal stability of microstructure
electron backscattering diffraction
grain size
texture
NDLC: ZP41
Target Audience: 一般
Holding library: 国立国会図書館
Call No.: Z53-J286
Data Provider (Database): 国立国会図書館 : 国立国会図書館雑誌記事索引
https://ndlsearch.ndl.go.jp
Bibliographic ID (NDL): 10532943
http://id.ndl.go.jp/bib/10532943
Bibliographic Record Category (NDL): 632