多層基板の熱変形挙動の予測およびそのパッケージの反り解析への適用
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- Material Type
- 記事
- Author/Editor
- 松田 和敏池田 徹宮崎 則幸
- Alternative Title
- Prediction of thermal deformation of multi-layered substrate, and its application to warpage analysis of package
- Periodical title
- 日本機械学会論文集. A編
- No. or year of volume/issue
- 76(762) 2010.2
- Volume
- 76
- Issue
- 762
- Pages
- 127～135