発熱チップの温度予測技術(特集システム実装を支える設計・シミュレーション技術)

Journal name: エレクトロニクス実装学会誌 = Journal of the Japan Institute of Electronics Packaging 13(4) (通号 87) 2010.7

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Material Type: 記事
Title: 発熱チップの温度予測技術
Author/Editor: 田岡直人
Series Title: 特集システム実装を支える設計・シミュレーション技術
Author Heading: 田岡直人
Alternative Title: Junction temperature prediction technique for LSI
Periodical title: エレクトロニクス実装学会誌 = Journal of the Japan Institute of Electronics Packaging
No. or year of volume/issue: 13(4) (通号 87) 2010.7
Volume: 13
Issue: 4
Sequential issue number: 87
Pages: 268～274
Publication date of volume/issue (W3CDTF): 2010-07
ISSN (Periodical Title): 1343-9677
ISSN-L (Periodical Title): 1343-9677
Publication (Periodical Title): 東京 : エレクトロニクス実装学会
Place of Publication (Country Code): JP
Text Language Code: jpn
NDLC: ZN33
Target Audience: 一般
Holding library: 国立国会図書館
Call No.: Z74-B258
Data Provider (Database): 国立国会図書館 : 国立国会図書館雑誌記事索引
https://ndlsearch.ndl.go.jp
Bibliographic ID (NDL): 10763715
http://id.ndl.go.jp/bib/10763715
Bibliographic Record Category (NDL): 632