200℃動作SiCスイッチングモジュールの開発
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- Material Type
- 記事
- Author/Editor
- 徳田 人基田中 保宣仲川 博 他
- Alternative Title
- Fabrication of 200℃-operated SiC switching module
- Periodical title
- エレクトロニクス実装学会誌 = Journal of the Japan Institute of Electronics Packaging
- No. or year of volume/issue
- 13(4) (通号 87) 2010.7
- Volume
- 13
- Issue
- 4
- Sequential issue number
- 87