半導体ウェーハテスト工程の納期を改善する手法と評価

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半導体ウェーハテスト工程の納期を改善する手法と評価

Call No. (NDL)
Z16-607
Bibliographic ID of National Diet Library
10766417
Material type
記事
Author
奥村 憲三ほか
Publisher
東京 : 電子情報通信学会エレクトロニクスソサイエティ
Publication date
2010-07
Material Format
Paper
Journal name
電子情報通信学会論文誌. C, エレクトロニクス = The IEICE transactions on electronics. C / 電子情報通信学会 編 93(7) (通号 511) 2010.7
Publication Page
p.231~240
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Paper

Material Type
記事
Author/Editor
奥村 憲三
多田 哲生
小山 健
Alternative Title
A methodology for improving delivery time in a semiconductor wafer test process and its evaluation
Periodical title
電子情報通信学会論文誌. C, エレクトロニクス = The IEICE transactions on electronics. C / 電子情報通信学会 編
No. or year of volume/issue
93(7) (通号 511) 2010.7
Volume
93
Issue
7
Sequential issue number
511