高温高湿条件下におけ...

高温高湿条件下におけるはんだウィスカの成長機構

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高温高湿条件下におけるはんだウィスカの成長機構

Call No. (NDL)
Z17-314
Bibliographic ID of National Diet Library
10769636
Material type
記事
Author
野津 敬ほか
Publisher
仙台 : 日本金属学会 ; 1937-
Publication date
2010-08
Material Format
Paper
Journal name
日本金属学会誌 = The journal of the Japan Institute of Metals and Materials 74(8) 2010.8
Publication Page
p.485~492
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Paper

Material Type
記事
Author/Editor
野津 敬
古志 益雄
山本 浩司 他
Alternative Title
The effects of the soldering process on whisker growth on solder alloys under the conditions of high temperature and high humidity
Periodical title
日本金属学会誌 = The journal of the Japan Institute of Metals and Materials
No. or year of volume/issue
74(8) 2010.8
Volume
74
Issue
8
Pages
485~492