Effect of N2 gas flow ratio in plasma-enhanced chemical vapor deposition with SiH4-NH3-N2-He gas mixture on stress relaxation of silicon nitride (Special issue: Dry process)

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Effect of N2 gas flow ratio in plasma-enhanced chemical vapor deposition with SiH4-NH3-N2-He gas mixture on stress relaxation of silicon nitride(Special issue: Dry process)

Call No. (NDL)
Z53-A375
Bibliographic ID of National Diet Library
10793926
Material type
記事
Author
Tatsunori Murataほか
Publisher
Tokyo : The Japan Society of Applied Physics
Publication date
2010-08
Material Format
Digital
Journal name
Japanese journal of applied physics : JJAP 49(8) (2) 2010.8
Publication Page
p.08JF08-1~4
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Digital

Material Type
記事
Author/Editor
Tatsunori Murata
Yoshihiro Miyagawa
Masazumi Matsuura 他
Periodical title
Japanese journal of applied physics : JJAP
No. or year of volume/issue
49(8) (2) 2010.8
Volume
49
Issue
8
Other Volume
2